EAF-501 Aluminum Foil Panel Encapsulated Raised Floor System

EAF-501 Aluminum Foil Panel Encapsulated Raised Floor System

B1/RE15 Fire Resistance and Economic Structure, our encapsulated raised floor panels are produced using high-density chipboard in various thicknesses such as 30 mm / 38 mm, with surface and base areas covered with 0.5 mm aluminum foil.

Encapsulated raised floor systems are used with a raw steel surface as well as commonly completed with carpet tile flooring.

General considerations in panel production include ensuring the panels are precisely milled in millimeters and that the steel is well coupled with chipboard.

Our panels, produced with German technology and patent, offer the following features for your projects:

  • Panels produced with German Technology and Patent
  • Special braced support systems applicable up to 120 cm height
  • Seismic infrastructure support systems
  • B1/RE15 Fire Resistance Feature
  • Modular wedge support systems
  • Production and Workmanship Guarantee

These features differentiate us from our competitors and make a significant impact on both our customers and ourselves.

At Krom Yapı, our wide range of alternative support systems and diverse production capabilities have been crowned with top-notch technical applications in various fields (Thermal Power Plants, Energy Production Facilities) and prestigious references (Kolin Construction Soma Thermal Power Plant, Global Investment Mavi Bayrak Söke Energy Plant, İzmir Metropolitan Municipality, etc.).

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